WD and Toshiba Produce First 512 Gigabit 64-Layer 3D NAND Chip
Western Digital Corp. announced pilot production of the first 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan, with mass production expected in the second half of 2017. The company describes the first production as a significant achievement in a nearly three-decades-long legacy of flash memory innovations. “The launch of the […]





