Femtocells and LTE Symbiosis
by Sanket S. Nesargi
Topics: Main | DSL | VoIP | Wi-Fi | WiMax | Ethernet | 40 Gbps | Financials | Optical Silicon | People | Start-ups | Europe | Japan |
Acquisitions of Silicon Companies | Silicon Directory | Archive
SiBEAM Raises $36.5 Million for 60 GHz Chips for WirelessHD
SiBEAM, a start-up based in Sunnyvale, California, raised $36.5 million in Series D funding for its 60 GHz CMOS chipsets for WirelessHD applications. The company's second generation 60 GHz wireless high definition chipsets are targeting the mainstream consumer electronics marketplace, as well as fund future projects for personal computing and mobile devices.
The second generation of SiBEAM's WirelessHD chipsets, which were brought into mass production earlier this year, support advanced features including 3D, HDCP and DTCP content protection that can be designed into A/V receivers, home theater-in-a-box systems, Blu-ray players, set-top boxes, media center PCs, and consumer laptops.
The new funding was led by Foundation Capital. All of SiBEAM's original investors contributed to this round including U.S. Ventures Partners (USVP) and New Enterprise Associates (NEA), joined by new partners in SiBEAM's success, Lux Capital and Hatteras Funds. Best Buy Inc, and Cisco have also contributed strategic equity investments to support SiBEAM's growth.... > More
Tilera Raises $25 Million for Multicore Processors
Tilera, a start-up based in San Jose, California, closed a $25 million series-C round of investment financing for its multicore silicon. The round was oversubscribed and included funds from three new strategic investors: Broadcom, Quanta Computer and NTT Financing Corp. This brings the total venture capital investment in Tilera to $64 million.Tilera's processors are based on its "iMesh" architecture that scales to hundreds of RISC-based cores on a single chip. Tilera has two product families, the TILE and TILEPro™, currently shipping to customers in networking, wireless infrastructure, communications and cloud computing markets. In October 2009 Tilera announced its TILE-Gx™ family, which includes the world's first 100-core processor. This line will begin sampling later this year.
Tilera also announced the appointment of Nariman Yousefi, Senior Vice President of Infrastructure Technologies at Broadcom, to the Tilera Board of Directors.
Mindspeed Debuts Optical Chipsets for Linking Base Stations to Radio Heads
Mindspeed Technologies announced a high-performance, low-power physical media device (PMD) chipset that includes all necessary components required for CPRI-based optical transceivers for connecting 3G/4G wireless base station servers to one or more remote radio heads (RRHs) over optical fiber.Mindspeed said its new PMD chipsets support the latest CPRI V4.1 2009-02-18 specification and are optimized for 4.915 Gbps and 6.144 Gbps operation with lower power consumption compared to the traditional 10 Gbps PMD chipsets. They support data rates from 614.4 Mbps to 6144 Mbps over 20km Single-Mode-Fiber (SMF) and 500m Multi-Mode-Fiber (MMF). The receiver solution includes the M02020 transimpedance amplifier (TIA) combined with the M02049 limiting amplifier, optimized for 4.915 Gbps or the M02129 TIA, combined with the M02142 limiting amplifier for 6.144Gbps. The limiting amplifiers each feature selectable band-width for optimal receiver sensitivity across CPRI rates. On the transmit side, solutions include the M02061 laser driver for long-wave laser diodes and the M02069 driver for short-wave vertical-cavity surface-emitting lasers (VCSELs).
Mindspeed has also collaborated with EMCORE'S Fiber Optics Division to develop a family of transmit and receive optical subassembly solutions based on Mindspeed's PMD devices. This family of products will allow base station servers to transmit over longer distances and at significantly higher data rates than can be supported with copper links.
ZTE Picks Siverge Networks' Chip for Multi-Service Access
ZTE has selected Siverge Networks' flagship "Griffin" chip for use in multi-service and wireless backhauling products.The Griffin family of chip solutions collapses multiple systems into a single multi-service card, performing transport and aggregation functions needed to create a bridge between legacy systems and new services and networks.
In addition, Siverge Networks recently unveiled a low-cost, high-performance Universal Gateway solution for mobile backhauling infrastructure and evolving Carrier networks. The new offering, known as the "SivGate" extends the Griffin family of products, enabling cost-efficient multi-service transport and aggregation solutions -- starting with low-end wireless cell site collocation and aggregation, up to high speed complete multi-service gateway for the Access and Core. Siverge's SivGate is compliant with required physical interfaces (Ethernet, PDH, SONET/SDH), as well as complete set of associated Layer 2 data and bundling protocols (i.e. ATM/IMA and HDLC/MLPPP) along with CES and PWE3, QoS and TM. Siverge said its SivGate solutions could be used in linecards designed to fit any existing or new network equipment.
DS2 Files for Bankruptcy Reorganization
DS, which supplies high-speed powerline and coax communications silicon, initiated a voluntary Concurso de Acreedores (similar to a Chapter 11 filing) in the Spanish courts while it develops a plan of reorganization to address its debt. DS2 said it will continue to operate as usual and continue its long-standing commitment to its customers, suppliers, partners and employees.
DS2 is in the process of finalizing development of its G.hn chipset and will have samples in Q3. DS2's next generation G.hn silicon is also compatible with the installed base of UPA devices providing extended life cycle and investment protection for current deployments of DS2 technology.
"Our business is returning to normal and 2010 run rates are back at 2008 levels. We expect to emerge from this process as a stronger, healthier and more competitive company and continue our legacy of delivering excellence in innovation and customer satisfaction by creating the most advanced and sustainable standards based semiconductors for high-speed communications over existing wires", said José Angel Martín, DS2 CFO.
No records returned.
Search
this site
Search
the Web
Femtocells and LTE Symbiosis
by Sanket S. Nesargi
LTE -- What Voice Services?
by Jose Deras
Framing the Next Wave of Carrier Ethernet
by Umesh Kukreja
Network Interconnection and Evolution for Super Carriers
by Dawn M. Hogh
Carrier Challenges for Tomorrow's Connected Enterprise
by Dr. Badri Nath
Dynamic Performance Management for Mobile Data Networks
by Michael J. Schabel, Ph.D.
E-mail Newsletter
