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Qualcomm Outlines M2M Silicon Roadmap
Qualcomm outlined its roadmap for the Internet of Everything (IoE) or machine-to-machine (M2M) applications, including 1X, EV-DO, HSPA and LTE cellular chipsets, all featuring its Gobi modem technology.
At the high-end of the roadmap are the dual-core Snapdragon S4 MSM8960 and MDM9x15 chipsets, which incorporate LTE, HSPA+ and EV-DO Rev. B and are targeted at M2M applications requiring integrated application processing and mobile broadband capabilities, such as automotive infotainment and digital signage. The Qualcomm MDM6600 (HSPA/EVDO Rev. B) and MDM6200 (HSPA) chipsets target applications such as telematics that require cross-regional connectivity. The QSC6270 (HSDPA) and QSC1105 (1X/GPRS) chipsets target entry-level M2M applications, such as smart metering, home security and industrial automation.
The Qualcomm Atheros AR4100 and AR4100P, single-chip, single-stream 802.11n Wi-Fi system-in-package solutions with an integrated networking stack. These target low-energy monitoring and control applications. The Qualcomm Atheros QCA7000 chip enables smart energy and automation applications with an M2M HomePlug Green PHY powerline communications solution that is low energy and cost effective while providing for easy integration into customer designs.
Qualcomm has also launched M2MSearch.com, a searchable database that helps developers in selecting the appropriate cellular and connectivity hardware for their M2M devices. ...
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