Wednesday, September 28, 2016

Fast Forward Labs: The Growing Impact of AI on Networks

Kathryn Hume, President of NYC-based Fast Forward Labs, discusses the growing impact of artificial intelligence on the world of networking.  We're already seeing the first applications, such as resource optimization.

Filmed at Net Events' Global Press & Analyst Summit in California.




See video: https://youtu.be/C-ZJO7K3sck

http://www.netevents.org
http://www.fastforwardlabs.com/


Cylance: AI and Cybersecurity

James E. Carroll

Stuart McClure, CEO and founder of Cylance, discusses the intersection of artificial intelligence and cybersecurity.

Cylance, which has been selling its AI-based solution for about 2 years, has grown to over 700 employees and about 3,000 customers with some 3 million endpoints.

Filmed at Net Events' Global Press & Analyst Summit in California.

 

See video: https://youtu.be/27yUlW0lskg

http://www.netevents.org/
http://www.cylance.com


ARM Releases a New Coherent On-Chip Interconnect Technology

ARM released a new CoreLink CMN-600 Coherent Mesh Network interconnect and CoreLink DMC-620 Dynamic Memory Controller technology enabling the latest ARM-based SoCs to offer unmatched data throughput and the lowest edge to cloud latency in the market.

Key attributes:

  • New architecture achieving higher frequencies (2.5 GHz and higher), 50 percent lower latency
  • 5x higher throughput and more than 1TB/s of sustained bandwidth
  • New Agile System Cache with intelligent cache allocation to enhance any sharing of data between processors, accelerators and interfaces
  • Supporting CCIX the open industry standard for coherent multi-chip processor and accelerator connectivity
  • CoreLink DMC-620 includes integrated ARM TrustZone security and supports 1 to 8 channels of DDR4-3200 memory and 3D stacked DRAM for up to 1TB per channel
  • Accelerated SoC development and system deployment

The company said its new on-chip interconnect technology has applicability across multiple markets including 5G networks, data center infrastructure, HPC, automotive and industrial systems.

"The demands of cloud-based business models require service providers to pack more efficient computational capability into their infrastructure," said Monika Biddulph, general manager, systems and software group, ARM. "Our new CoreLink system IP for SoCs, based on the ARMv8-A architecture, delivers the flexibility to seamlessly integrate heterogeneous computing and acceleration to achieve the best balance of compute density and workload optimization within fixed power and space constraints."

http://www.arm.com/about/newsroom/arm-system-ip-boosts-soc-performance-from-edge-to-cloud.php

Nutanix Prices IPO Shares in $13-15 Range

Shares in Nutanix are expected to begin trading on The NASDAQ Global Select Market under the symbol “NTNX.”

The company expects the initial public offering price will be between $13.00 and $15.00 per share, potentially raising up to $241.5 million for the San Jose based firm.


Nutanix S1 Filing: Quarterly Revenue at $139.8 million


For its most recently fiscal quarter ended 31-July-2016, Nutanix recorded revenue of $139.8 million, according to a recently updated Form S-1 registration statement filed with the SEC ahead of a potential initial public offering (IPO). Nutanix provides a next-generation enterprise cloud platform that "converges traditional silos of server, virtualization and storage into one integrated solution and can also conn

China Unicom Expands Deployment of Nokia Core Routers

China Unicom selected the Nokia 7950 XRS core router family for additional deployments across China. Financial terms were not disclosed.

China Unicom initially deployed the 7950 XRS into metro networks in six provinces - Beijing, Shandong, Jiangsu, Jiangxi, Inner Mongolia and Qinghai - and this year plans to scale out to an additional four including Heilongjiang, Henan, Zhejiang and Hunan to improve speed and response times for the fixed and mobile broadband subscribers.

In 2013 China launched its Broadband China initiative to invest $182 billion to boost the speed and quality of Internet services across the country. The aim is to reduce the digital divide by providing businesses and urban and rural citizens with national broadband coverage by 2020. In keeping with this initiative, China Unicom has been continually improving the scale and capacity of its networks.

http://www.nokia.com


OIF Begis Work on IC-TROSA and CFP2-Digital Coherent Optics Project

The Optical Internetworking Forum’s (OIF) has begun work on two optical interface projects:

the IC-TROSA project would enable manufacturers to have a higher level of integration for transmit and receive optical components. Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) is the evolutionary step that combines Polarization Multiplexed Quadrature (PMQ) Transmitter (Tx) and Integrated Coherent Receiver (ICR) components to create a single integrated optics package.  The optical sub-assembly that supports high-bandwidth and high-order QAM operations is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, current coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards, and transport. Density requirements for next-gen line cards, front-pluggable and future on-board 400G+ optical modules are driving the need for further integration and miniaturization.

the CFP2-Digital Coherent Optics (DCO) project will work with other standards bodies to implement coherent modulations formats in CFP modules. The OIF’s CFP2-DCO project includes a way to build address management interface and identify registers necessary to talk to the DSP located in the module, specific to coherent modulation techniques. The CFP2-DCO is intended to be used for 100G, 200G or 400G applications for metro, long-haul and data center interconnections and it can support different formats such as DP-QPSK and DP-xQAM.

“The IC-TROSA project tackles much more than just a simple size reduction,” said Karl Gass of Qorvo and the OIF’s Physical and Link Layer (PLL) Working Group – Optical vice chair.  “It addresses optical packaging in a way that isn’t done in high volumes today. We want to come to industry consensus in this pre-competitive environment.”

http://www.oiforum.com.

5G Automotive Association Gets Underway

A new 5G Automotive Association has been formed with the backing of AUDI AG, BMW Group, Daimler AG, Ericsson, Huawei, Intel, Nokia and Qualcomm.

The mission is to develop, test and promote communications solutions, support standardization and accelerate commercial availability and global market penetration of 5G technologies and intelligent transportation.

The association said it will address key technical and regulatory issues, leveraging next generation mobile networks and integrating vehicle platforms with connectivity, networking and computing solutions. The main activities of the association include:

  • Defining and harmonizing use cases, technical requirements and implementation strategies. 
  • Supporting standardization and regulatory bodies, certification and approval processes.
  • Addressing vehicle-to-everything technology requirements, such as wireless connectivity, security, privacy, authentication, distributed cloud architectures and more.  


Christoph Voigt is appointed Chairperson of the Board and Dino Flore is appointed Director General of the Association.

"We expect 5G to become the worldwide dominating mobile communications standard of the next decade. For the automotive industry it is essential that 5G fulfills the challenges of the era of digitalization and autonomous driving. With the 5G Automotive Association we founded a cross-industry forum that allows us to shape the future 5G technology with leading ICT companies. As a co-founder of the 5G Automotive Association we would be excited to welcome further partners engaged in the automotive industry, the information and communication technologies or mobile network operators in the association," stated Dr. Christoph Grote, Senior Vice President Electronics, BMW Group.

See also