Western Digital has achieved pilot production of 3D NAND technology in 64 layers.
The technology, which WD is calling BiCS3, was developed jointly with Toshiba, its manufacturing partner. It will be initially deployed in 256 gigabit capacity and will be available in a range of capacities up to half a terabit on a single chip.
WD expects commercial volumes of BiCS3 in the first half of calendar 2017.
"The launch of the next generation 3D NAND technology based on our industry-leading 64 layer architecture reinforces our leadership in NAND flash technology," said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. "BiCS3 will feature the use of 3-bits-per-cell technology along with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost. Together with BiCS2, our 3D NAND portfolio has broadened significantly, enhancing our ability to address a full spectrum of customer applications in retail, mobile and data center."