Wednesday, October 8, 2014

Open Interconnect Consortium Gets Underway

A new Open Interconnect Consortium has begun work to define the connectivity requirements to improve interoperability between the billions of devices making up the Internet of Things (IoT).  The group recently appointed its leadership:

  • President: Jong-Deok Choi, executive vice president and deputy head of Software R&D Center, Samsung Electronics
  • Vice President: Imad Sousou, vice president, Software and Services Group and general manager, Intel Open Source Technology Center, Intel Corporation
  • Secretary: Bernard Shung, general manager, new business development, MediaTek
  • Treasurer: Kip Compton, vice president, IoT Systems and Software Group, Cisco


The goal of the Open Interconnect Consortium is to develop an open specification and connectivity framework to enable application developers and device manufacturers to deliver interoperable products across Android, iOS, Windows, Linux, Tizen, etc.

The standard will include IP protection & branding for certified devices (via compliance testing) and service-level interoperability.

Twenty-seven companies have joined the consortium, including Acer, ActnerLab, Allion, Aepona, Cisco, Cryptosoft Ltd, Eyeball Networks, Global Channel Resource, Gluu, IIOT Foundation, InFocus, Laplink Software, Mashery, McAfee, MediaTek, Metago, NewAer, Nitero, OSS Nokalva Inc., Realtek Semiconductor Corp., Remo Software, Roost, SmartThings, Samsung Electro-Mechanics, Thug Design, VMC and Zula.

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