Sunday, May 5, 2013

Huawei Discloses 400G Photonic Integrated Device

Huawei announced the development of a photonic integrated device (PID) that leverages advanced modulation and digital signal processing (DSP) technology to support 40 Gbps, 100 Gbps, 400 Gbps and  higher transmission rates.  Huawei said its device can achieve distances of up to 80 km without the need for a complex design at the photonic layer or auxiliary units such as optical amplifiers and dispersion compensation modules (DCMs). The device supports multi-service native transport and is implemented on a single 2 cm2 chip.


Huawei will used this new-generation PID chip for a smart line card for its Hybrid MSTP products. The smart line card supports the native and unified transport of different types of services (including Ethernet, ATM, and TDM) over one port, as well as smooth evolution among these services, effectively protecting operators' infrastructure investment.

"The surge in data traffic has created a growing demand for bandwidth on metro networks. With support for multi-service transport and smooth network evolution, Huawei's new-generation PID solution helps operators build future-ready networks, while preserving the profits of traditional voice services," said Jack Wang, President of the Huawei Transport Network Product Line.

http://www.huawei.com/en/about-huawei/newsroom/press-release/hw-260599-pidtnmo.htm

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