Tuesday, November 15, 2011

Qualcomm Releases Gobi 4000 LTE/HSPA+ and LTE/EV-DO Silicon

Qualcomm has released its Gobi 4000 embedded modem chipsets for LTE.


The Gobi 4000 platform, which represents the next generation of the company's existing multimode 3G/4G wireless modems, allows mobile device manufacturers to offer both LTE/HSPA+ and LTE/EV-DO designs. The new silicon features the Gobi Application Programming Interface (API) with LTE extensions and is compatible with leading connectivity standards, including CDMA2000 1xEV-DO Rev. A and B, HSPA+, dual-carrier HSPA+, and LTE with integrated backwards compatibility to HSPA and EV-DO.


The Gobi 4000 platform also includes software enhancements for select MDM chipsets that enable a common software interface to help connect, locate and manage 3G/4G devices regardless of wireless interface and operating system.


“Embedded modules based on our new Gobi 4000 technology are designed to give consumers an uncompromised mobile connectivity experience, both in terms of download speeds and flexibility,�? said Cristiano Amon, senior vice president of product management for Qualcomm CDMA Technologies. “To make Gobi 4000 available to as many consumers as possible, Qualcomm has worked hard to ensure that OEMs can use the platform on many commonly used personal computing, tablet and e-reader operating systems, including Windows and Android, and hardware architectures, such as our powerful Snapdragon™ dual-core and quad-core processors.�?


Gobi 4000-based modules are now available from Novatel Wireless and Sierra Wireless.

http://www.qualcomm.com

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