Sunday, February 7, 2010

Vitesse Outlines Ethernet Chip Roadmap for 2010

After 18 months of restrained capital expenditure, Vitesse Semiconductor believes carrier and data center markets are poised for significant growth in 2010 and beyond. During the downturn, Vitesse has boosted its research and development staff by 15 percent. In its product pipeline is a suite of more than 30 products bringing higher performance to the Enterprise and new carrier features to the public network.


Product introductions planned in 2010 include:

  • High-density PHYs for 10G/40G/100G optical and backplane applications;

  • High-density 10G OTN Mappers/PHYs for the Carrier wavelength-division-multiplexed (WDM) Metro and Core;

  • 40G/100G FEC devices for the Carrier Core;

  • 1/10 Gigabit Ethernet (GbE) Carrier Ethernet switches and MACs for carrier and metro aggregation including wireless backhaul;

  • GbE Carrier Ethernet access switches for wireless/microwave backhaul edge applications and base stations;

  • 12/24-port GbE Enterprise Layer 2 switches for small-medium enterprise (SME)/small-medium business (SMB);

  • Energy-Efficient Ethernet physical-layer PHYs for copper and fiber


Vitesse also noted that it is implementing stringent network timing features based on Synchronous Ethernet and the IEEE-1588 Precision Timing Protocol in its Media Access Controllers (MACs), switches, and physical layer (PHY) products.
http://www.vitesse.com

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