Sunday, October 14, 2007

Broadcom Unveils First "3G Phone on a Chip" HSUPA Solution

Broadcom announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die.



Broadcom said its new "3G Phone on a Chip" solution enables manufacturers to build next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions.



Phones enabled by the new Broadcom HSUPA processor will support download speeds up to 7.2 Mbps, and upload speeds of up to 5.8 Mbps. HSUPA technology also holds the promise for much higher quality "live" video conferencing.



The new BCM21551 3G chip combines a high-speed HSUPA 3G baseband, a multi-band radio frequency (RF) transceiver, Bluetooth 2.1 with enhanced data rate (EDR) technology, an FM radio receiver and an FM radio transmitter (for car stereo music playback). The device also features advanced multimedia processing, up to five Megapixel camera support, and 30 frame per second video with "TV Out," as well as support for the HSUPA, HSDPA, WCDMA and EDGE cellular protocols. It can even be paired with other Broadcom devices, such as Wi-Fi and GPS, PMU, or the new VideoCore III mobile multimedia processor.



It is designed and manufactured on a single 65 nanometer silicon die. The BCM21551 3G baseband processor is available now to early access customers and is priced at $23.00 in large quantities.

http://www.broadcom.com

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