Thursday, July 27, 2006

QUALCOMM Signs Fabrication and Test Deal with SMIC

QUALCOMM announced a strategic agreement with Semiconductor Manufacturing International Corporation (SMIC), one of the leading semiconductor foundries. SMIC will provide integrated circuit (IC) manufacturing services to QUALCOMM using a specialized BiCMOS process technology at its Tianjin, China facility. This agreement will combine SMIC's wafer fabrication capabilities and subcontractor infrastructure with QUALCOMM's 3G technology.

http://www.qualcomm.com

  • In June 2003, QUALCOMM announced plans to invest up to US$100 million in early- to mid-stage Chinese companies engaged in the development and commercialization of CDMA-based products, applications and services.


  • In March 2006, QUALCOMM announced the joint founding of TechFaith Software China Limited to focus on the development of application software for mobile devices.

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