Sunday, February 6, 2005

Actelis Raises $23 Million for Copper-Pair Bonding

Actelis Networks, a start-up based in Fremont, California with R&D in Israel, raised $23 million in Series D funding for its access technology that bonds copper pairs for delivering fiber-quality service over existing copper lines. Actelis' systems allow carriers to deploy ultra fast broadband at distances up to 18Kft (5.5km) and beyond from Central offices or Remote Terminals.



Actelis said recent standard specifications put forth by IEEE and ITU-T are critical milestones in the global market development of ultra high-speed broadband over copper. Actelis' MetaLIGHT 50, 1300 and 130 platforms are compliant with G.998.2 (Ethernet transport) similar to the IEEE 802.3ah EFM standard, while its MetaLIGHT 100E and MetaLIGHT 1500 platforms are compliant with G.998.3 (multi-service), which includes a Time-Division Inverse Multiplexing (TDIM) bonding protocol that was contributed to the standard by Actelis.



The new funding was led by ATA Ventures and included Innovacom Venture Capital, Dupont Capital Management, The Carlyle Group, Walden International, New Enterprise Associates and Vertex. To date, Actelis has raised close to $100 millionhttp://www.actelis.com

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